半導體減薄砂輪Semiconductor Thinner Grinding Wheel

  • 發布時間:2019-10-01
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半導體減薄砂輪Semiconductor Thinner Grinding Wheel(圖1)

減薄砂輪主要應用於半導體晶圓的減薄與精研加工。我公司生產的減薄砂輪可替代進口產品,在日本、德國、美國、韓國及國產磨床上穩定使用,砂輪磨削性能優越,性價比高。

Back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by our institute which possess superior grinding performance and high cost.

Performance are among the top level worldwide. They can be used with the Japanese, German, American, Korean and Chinese grinders.

 

加工對象:分立器件、集成電路襯底及原始晶片等。

工件材料:單晶矽、砷化镓、磷化銦、碳化矽等半導體材料。

應用工序:背麵減薄、正麵磨削的粗磨加工和精研加工。

Workpiece processed: silicon wafer of discrete devices, integrated chips(IC) and virgin etc.

Material of workpiece: monocrystalline silicon and some other semiconductor materials.

Applications: back thinning, rough grinding and fine grinding.

半導體減薄砂輪Semiconductor Thinner Grinding Wheel(圖2)

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